ElectroScrub1 - pH10/pH12/pH14
The Solution For Contamination-Sensitive Cleaning Needs
- Increased Particle Removal Efficiency (PRE)
- More Effective than Typical SC-1 Processes
- Can Be Used in Single Wafer or Batch Type Equipment
- Safe for Glass, Ceramics and Silicon Surfaces
- Effective at Many Stages of the Manufacturing Process
- Removes Particles most effectively in combination with Megasonics or brush scrubbing
- High Perfomance and Cost Effective
ElectroScrub1 is a technologically advanced cleaning chemistry designed to meet the challenges of cleaning effectively. ElectroScrub1 provides effective cleaning characteristics at ambient temperatures or slightly heated in static or filtered recirculated baths.
The current FEOL process SC-1 (Standard Clean 1) or APM (Ammonia Peroxide Mixture) requires heated chemistry and is limited in highly effective particle removal.
ElectroScrub1 is chemically formulated to modify electrostatic surface charges on the wafer surface and on the particles. The electrostatic repulsion forces remove particles and in conjuction with additional mechanical force from megasonics or under-cut etching from elevated bath chemistries result in superior cleaning. The addition of megasonics or aerosol jet bombardment or brush scrubbing to ElectroScrub1 will significantly increase particle removal efficiency.
SOLUTION MAKE UP For general partical removal, ElectroScrub1 diluted 1:10 with DI H 2 O cleans effectively at room temperature or slightly heated to 40C.
VARIETIES
ElectroScrub1 comes in three (3) different varieties:
ElectroScrub1-pH10
ElectroScrub1-pH12
ElectroScrub1-pH14
The only difference between the three varieties is pH content. The pH10 version has a pH of 10.x after dilution with H 2 O 1:10. The pH12 version has a pH of 12.x after dilution with H 2 O 1:10 and the pH 14 version has a pH of about 14 after dilution 1:10 with DI Water.
NOTE: Electro Scrub Technology, Inc. can also make custom pH modified versions of ElectroScrub1.
TYPICAL APPLICATIONS
Typical applications are where cleaning with KOH based solutions can be used, such as bare glass substrate cleaning.
There is also an NH 4 OH or TMAH based solution available on special request.
APPLICATION DATA
ElectroScrub1 works by putting an extremely strong negative charge on both the particle and the wafer surface. This creates a strong repulsion force removing the particle from the surface. DI water rinsing then carries the particle away from the vicinity of the wafer surface into the bulk liquid and down the drain. When the particles are separated from the surface they are moved away from the substrate and filtered out in the bath re-circulation system.
EQUIPMENT RECOMMENDATION
ElectroScrub1 is extremely effective in both Single Wafer or in Batch Type equipment. Single Wafer equipment is typically dispense-spin type. Batch Type equipment is typically either bath (or tank/immersion) type or spray type.
MATERIALS OF CONSTRUCTION : PFA recommended for supply lines. Batch Tank material PFA or quartz glass. Single Wafer Bowl material PVDF or Polyethylene/Polypropylene. Drain lines PFA, PVDF, Polyethylene, Polypropylene, PVC.
NOTE: Most single wafer tools do not adequately rinse the surface of the wafer. ElectroScrub1 removes particles from the wafer surface by electrostatic repulsion. However, rinsing is required to carry the particles from the liquid phase close to the wafer (10-100nm) into the bulk liquid and eventually down to the drain.
OPERATIONAL DATA
Temperature Range : |
Ambient - 70 º C |
Optimum Temperature: |
Ambient |
Time: |
1min – 20min (5 min is optimum) |
Dilution: |
1:10 Dilution with DI water |
Rinsing:
|
Rinsing plays an important role in the ElectroScrub1 cleaning process. ElectroScrub1 solution removes the particles from the wafer surface and keeps them suspended by electrostatic force at 10nm-100n from the wafer surface. A QDR cycle with a spray rinse step is necessary to optimize the cleaning process. Rinsing away the suspended particles completes the cleaning process. |
ElectroScrub1 is very popular for bare glass cleaning.
WHEN USING ON SILICON WAFERS
When using Electroscrub1 on silicon wafers, the Electroscrub1 pH10 is recommended and it is recommended to add H2O2 similar to a SC-1 solution. This is necessary to prevent any Si etching.
SOLUTION MAINTENANCE
Regular renewal of the solution or single pass use is recommended. Solution renewal is based on PRE, solution contamination, etc.
METHOD OF CONCENTRATION MONITORING
Conductivity, Refractive Index, Spectroscopic methods may all be used to monitor the ElectroScrub1 solution. An initial signature figure needs to be obtained and this can be used to monitor the state of the solution.
PROPERTIES
Flashpoint: not flammable
Auto-Ignition Temperature: not flammable
Appearance: clear liquid
Odor: No odor
Boiling Point: >100 ° C
Melting Point: <0 ° C
Specific Gravity: 1.55 g/cm3
Solubility in H 2 O: completely soluble
pH: 10.x, 12.x or 14.x depending on ElectroScrub1 pH10/pH12 or pH14 (after dilution with H2O 1:10 )
Shelf Life: 6 months
OTHER NOTES
Standard ElectroScrub1 contains K (Potassium)
Special ElectroScrub1 based on NH4OH or TMAH is possible.
SAFETY
For safety information, please consult the Material Safety Data Sheet for this product.
Call us:
1-408-871-4371
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